Additive Manufacturing
Unlocking the Future of Production with Additive Manufacturing


BINDSOL: Precision Metal 3D Printing with LPBF Technology
At BINDSOL, we leverage Laser Powder Bed Fusion (LPBF) technology—also known as Direct Metal Laser Sintering (DMLS), Selective Laser Melting (SLM), and Direct Metal Printing (DMP)—to produce high-performance metal components with near 100% density and exceptional mechanical properties.
Using a high-powered fiber laser, LPBF selectively melts ultra-fine layers of metal powder, building complex geometries with unmatched precision and consistency. As each layer solidifies, the result is a fully functional, end-use part ready for demanding applications.
BINDSOL’s expertise spans a range of high-performance alloys, including Titanium, Aluminum, Stainless Steel, and Nickel- & Copper-based alloys, ensuring optimal material solutions for all companies out there ready to embrace this cutting edge technology.With a commitment to quality, innovation, and speed, BINDSOL transforms ideas into precision-engineered components—delivering performance without compromise.
Benefits of Additive Manufacturing

High Precision
Produces intricate geometries with fine details and high accuracy.

Material Efficiency
Minimizes waste by utilizing only the required amount of metal powder.

Superior Mechanical Properties
Creates parts with excellent strength, durability, and thermal resistance.

Design Freedom
Enables the production of complex, topology-optimized structures impossible with conventional methods.

Rapid Production
Reduces lead times for prototypes and end-use parts.

Metal Materials for SLM
Our Metal SLM ( aka. LBPF ) technology supports a range of high-performance materials, including:
- Aluminium Alloys
- Stainless Steel
- Titanium Alloys
Our Polymer FDM technology supports a range of materials, including:
- ABS-M30
- ASA
- ABS-CF10
- PLA (uses breakaway support only)
- QSR support material
- FDM TPU 92A
Reach out operations@bindsol.eu for material datasheets and part size limitations.